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SOM-SMARC-APL

搭载英特尔®凌动™ X 系列、英特尔®赛扬® J/N 系列和英特尔®奔腾® N 系列(原名 Apollo Lake)处理器 SMARC®Rel. 2.1 模块

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors

Graphics

Intel® HD Graphics 500 series controller with up to 18 Execution Units

Connectivity

2x GbE; 6 x USB 2.0; 2 x USB 3.0; 4x PCI-e

Memory

Dual Channel Soldered Down LPDDR4-2400 memory

Product details

Technical Info

  • Description
    The SOM-SMARC-APL is a SMARC Rel. 2.1.1 compliant module with the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly code name Apollo Lake) Processors. This high performance, low power and feature-rich solution is able to run up to 3 independent displays, with 4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC. It features Dual Channel Soldered Down LPDDR4-2400 memory up to 8GB, up to 2 x Gigabit Ethernet interfaces and 2 x MIPI CSI interfaces.
  • Processor

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

  • Max Cores
    4
  • Max Threads
    4
  • Memory

    Single-/Dual-/Quad- Channel Soldered Down LPDDR4-2400 memory, up to 8GB

  • Graphics

    Up to 3 independent displays
    Integrated Intel® HD Grahpics 500 / 505 HD Graphics controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC

  • Video Interfaces

    eDP interface or Dual Channel 18/24bit LVDS interface through eDP-to-LVDS bridge
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

  • Video Resolution

    DP++ Up to 4096 x 2160 @60HZ

    eDP Up to 3840 x 2160 @60Hz

    HDMI Up to 3840 x 2160 @30Hz

    LVDS Up to 1920 x 1200 @ 60Hz

  • Mass Storage

    Optional eMMC 5.0 drive soldered on-board
    External S-ATA Gen3 Channel
    SD interface

  • Networking

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

  • USB

    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports

  • PCI-e

    4 x PCI-e Root Ports

  • Audio

    HD Audio interface
    I2S Audio interface

  • Serial Ports

    2x 2-wire HS-UARTs
    2x 4-wire UARTs

  • Other Interfaces

    Up to 14x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    FAN management
    Optional TPM 1.2 / 2.0
    Power Management Signals

  • Power Supply

    +5VDC and +3.3V_RTC

  • Operating System

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto

  • Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    50 x 82 mm (1.97” x 3.23”)

Part Number

  • RB69-6760-2211-I2-V

    Part number description
    SM-B69 - Intel Atom E3930, LPDDR4 4GB (4 chip x 8Gb), eMMC 32GB, LVDS, Displayport, 2x Eth ctrl I210, no TPM - Ind.Temp.
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