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SOM-COMe-CT6-R1000

搭载 AMD 锐龙™嵌入式 R1000 系列 SoC 的COM Express® Rel. 3.0 紧凑型 6 型模块

Product status

Development
Sampling
Production

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CPU

AMD Ryzen™ Embedded R1000 processors

Graphics

AMD Radeon™ Vega GPU with 3 Compute Units

Connectivity

4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3

Memory

Two DDR4 SO-DIMM Slots supporting DDR4-2400 ECC Memory

Product details

Technical Info

  • Description
    Low-end AMD Ryzen® on COM Express® Type 6 Compact
  • Processor

    AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.6GHz (3.5 Boost), TDP 12-25W
    AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.4GHz (3.3 Boost), TDP 12-25W
    AMD Ryzen™ Embedded R1305G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 1.5GHz (2.8 Boost), TDP 8-10W

  • Max Cores
    2
  • Memory

    Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB

  • Graphics

    AMD Radeon™ Vega 3 GPU with 3 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    3 independent displays supported

  • Video Interfaces

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0I
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface (factory alternatives to third DDI port)

  • Video Resolution

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200 @ 60Hz

  • Mass Storage

    2 x S-ATA Gen3 Channels

  • Networking

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

  • USB

    Up to 4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

  • PCI-e

    2 x PCI-e x1 Gen3 lanes
    Additional 3rd PCI-e x1 Gen3 lane or 3x PCI-e x1 Gen2 lanes (factory alternatives)
    PCI-express Graphics (PEG) x4

  • Audio

    HD Audio Interface

  • Serial Ports

    2 x UARTs

  • Other Interfaces

    SPI, I2C, SM Bus, LPC bus, FAN management
    Optional TPM 2.0 module on-board
    4x GPI, 4 x GPO

  • Power Supply

    +12VDC ± 10% and +5VSB (optional)

  • Operating System

    Windows 10 64-bit
    Linux

  • Operating Temperature

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

Part Number

  • MC89-1002-2311-C0-V

    Part number description
    COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @2.6GHz 15W, GbE I211, 2x DDI & LVDS, TPM2.0, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 - Comm. Temp
    Contact us for more informations or quotes
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  • MC89-2002-2311-C0-V

    Part number description
    COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I211, 2x DDI & LVDS, TPM2.0, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 - Comm. Temp
    Contact us for more informations or quotes
    联系我们
  • MC89-3002-2322-C0-V

    Part number description
    COMe-C89-CT6 w/AMD Ryzen Embedded R1305G @ 1.5GHz 8W, GbE I211, 2x DDI & LVDS, TPM2.0, 2xUSB3.0, 3x PCIe Gen3 - Comm. Temp
    Contact us for more informations or quotes
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