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SOM-COMe-CT6-MBPF

搭载 AMD 嵌入式第三代 R 系列 SoC(原名 Merlin Falcon)或 G 系列 SOC-I (原名 Brown Falcon)或 G 系列 SOC-J 处理器(原名 Prairie Falcon)的COM Express® 紧凑型 6 型模块

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

AMD Embedded 3rd generation R-Series SOC, G-Series SOC-I or G-Series SoC-J

Graphics

AMD Radeon 3rd -Generation Graphics Core Next (GCN)

Connectivity

4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3

Memory

Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules

Product details

Technical Info

  • Description
    SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip; each Processor can scale the TDP down to 15W. AMOS is ideal in applications where scalable graphics performance makes the difference.
  • Processor

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
    AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W

  • Max Cores
    4
  • Memory

    R-Series: Two SO-DIMM slots supporting DDR4 ECC / nonECC modules up to 2133MHz

    G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz

    G-Series SoC-J: One SO-DIMM slot supporting DDR4 nonECC modules up to 2133MHz

  • Graphics

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon R7
    AMD RX-418GD, RX-416GD - Radeon R6
    AMD-RX-216GD -  Radeon R5
    AMD GX-217GI - Radeon R6E
    AMD GX-224IJ - Radeon R4E
    AMD GX-215IJ - Radeon R2E
    Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported 

  • Video Interfaces

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J)
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)

  • Video Resolution

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200 @ 60Hz 

  • Mass Storage

    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os

  • Networking

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller

  • USB

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

  • PCI-e

    3 x PCI-e x 1 lanes 
    PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)

  • Audio

    HD Audio Interface

  • Serial Ports

    2 x HS UARTs

  • Other Interfaces

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)
    Optional TPM 1.2 or 2.0 module onboard 

  • Power Supply

    +12VDC ± 10% and + 5VSB (optional)

  • Operating System

    Microsoft® Windows 7
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Linux

  • Operating Temperature

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

Part Number

  • SOM-COMe-CT6-MBPF

    Part number description
    搭载 AMD 嵌入式第三代 R 系列 SoC(原名 Merlin Falcon)或 G 系列 SOC-I (原名 Brown Falcon)或 G 系列 SOC-J 处理器(原名 Prairie Falcon)的COM Express® 紧凑型 6 型模块
    Contact us for more informations or quotes
    联系我们

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