Product details
Technical Info
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DescriptionSOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip; each Processor can scale the TDP down to 15W. AMOS is ideal in applications where scalable graphics performance makes the difference.
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Processor
AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range
AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15WAMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W -
Max Cores4
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Memory
R-Series: Two SO-DIMM slots supporting DDR4 ECC / nonECC modules up to 2133MHz
G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz
G-Series SoC-J: One SO-DIMM slot supporting DDR4 nonECC modules up to 2133MHz
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Graphics
AMD Radeon 3rd -Generation Graphics Core Next (GCN)
AMD RX-421BD - Radeon R7
AMD RX-418GD, RX-416GD - Radeon R6
AMD-RX-216GD - Radeon R5
AMD GX-217GI - Radeon R6E
AMD GX-224IJ - Radeon R4E
AMD GX-215IJ - Radeon R2E
Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J)
DirectX® 12 supported
UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported -
Video Interfaces
Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J)
Optional VGA interface (excludes one DDI Port)
Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port) -
Video Resolution
DDIs: up to 4K
LVDS, VGA: up to 1920 x 1200 @ 60Hz -
Mass Storage
2 x SATA Gen3 Channels
SD interface shared with GPI/Os -
Networking
Gigabit Ethernet interface
Intel® I210 / I211 GbE Controller -
USB
4 x USB 3.0 Host ports
8 x USB 2.0 Host ports -
PCI-e
3 x PCI-e x 1 lanes
PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J) -
Audio
HD Audio Interface
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Serial Ports
2 x HS UARTs
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Other Interfaces
SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
LID# / SLEEP# / PWRBTN#, Watchdog
4 x GPI, 4 x GPO (multiplexed with SD interface)
Optional TPM 1.2 or 2.0 module onboard -
Power Supply
+12VDC ± 10% and + 5VSB (optional)
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Operating System
Microsoft® Windows 7
Microsoft® Windows 10
Microsoft® Windows 10 IoT
Linux -
Operating Temperature
0°C ÷ +60 °C (Commercial version)
-40°C ÷ +85°C (Industrial version)*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
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Dimensions95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
Software
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BIOS
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Tools and Documents
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EAPI
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Linux Kernel Patches
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Windows 10
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Windows 7
Documentation
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Data Sheet
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Manual
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Image
Part Number
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SOM-COMe-CT6-MBPF
Part number description搭载 AMD 嵌入式第三代 R 系列 SoC(原名 Merlin Falcon)或 G 系列 SOC-I (原名 Brown Falcon)或 G 系列 SOC-J 处理器(原名 Prairie Falcon)的COM Express® 紧凑型 6 型模块Contact us for more informations or quotes
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