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Trizeps VIII Plus

搭载恩智浦 i.MX 8M Plus 应用处理器的 SODIMM-200 中央处理器模块

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

NXP i.MX8M Plus Applications Processors

Graphics

Integrated GPU with multi display support GC520L 2D accelerator + GC7000UL 3D accelerator

Connectivity

2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth

Memory

Up to 8 GB LPDDR4-4000 memory

Product details

Technical Info

  • Description
    The new Trizeps VIII Plus CPU module uses the new i.MX 8M Plus processor from the NXP i.MX8 series. The i.MX 8M Plus SoC (System on Chip) has various processor units that can handle a wide range of computing operations. Of particular note is the NPU (Neural Processing Unit), which can handle computational processes in the field of AI (Artificial Intelligence) typically with learned neural networks. These can be used for pattern, speech and object recognition. and object recognition. This opens up new areas of application for the Trizeps VIII Plus SOM (System On Module). Equally important is the wide range of applications for the classic embedded functions. This is where the Dual Gigabit Ethernet and Dual CAN FD interfaces, which are used e.g. in industrial automation, are convincing. ""Low power"" applications or real-time applications can be provided by the integrated 800 MHz clocked Arm Cortex-M7 co-processor. USB 3.0 and PCIe are available as high-speed interfaces. The Trizeps VIII Plus can also be used for a wide range of multimedia applications. Fast image processing is enabled by high-performance video decoders and encoders as well as two image signal processors (Dual-ISP - Dual Image Signal Processor). Also, powerful audio and voice functions are available. Displays can be connected via HDMI, (dual-)LVDS or MIPI-DISI interfaces. Besides, the Trizeps VIII Plus extends the functionality of the i.MX 8M Plus SoC with the configurable FPGA, the programmable Kinetis Cortex M0+ MCU, the HiFi Audio Codec and the WLAN/Bluetooth module.
  • Processor

    NXP i.MX 8M Plus family SoCs: Dual or Quad ARM Cortex®-A53 Cores + general purpose Cortex® M7 800MHz processor
    • NXP i.MX 8M Plus Quad, 4x ARM Cortex®-A53 Cores up to 1.8GHz
    • NXP i.MX 8M Plus Dual, 2x ARM Cortex®-A53 Cores up to 1.8GH
    NPU: 2.3 TOPS Neural Network performance (not for Quad Lite)

    Optional: NXP™ Kinetis V Arm® Cortex-M0+ up to 75 MHz / 8x 16 Bit ADC, UART, SPI, GPIO, I2C
    Optional: Programmable FPGA, up to 4300 LUTs

  • Memory

    Soldered down LPDDR4-4000 memory, 32-bit interface, up to 8GB

  • Graphics

    Integrated Graphics Processing Unit GC7000UL, supports 3 independent displays.

    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-4, MPEG-2, MVC, VC-1, RV, VP6, VP7, VP8, VP9, JPEG, HW encoding of HEVC/H.265, AVC/H.264

    Supports OpenVG 1.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and Vulkan

  • Video Interfaces

    HDMI, MIPI display (4 channel) / Single- or Dual-LVDS, LCD 24 Bit RGB

  • Video Resolution

    HDMI, LVDS, eDP: Up to 1920 x 1080p @60
    Video-Decoder: 1080p60, h.265/4, VP9, VP8 / Video Encoder: 1080p60, h.265/4

  • Mass Storage

    Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC

  • Networking

    2x Gigabit Ethernet (1x RGMII PHY and 1x RGMII interface)
    Optional: WiFi 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2/5.0

  • USB

    2x USB 3.0 OTG

  • PCI-e

    Up to 1x PCI-e x1 Gen3 port

  • Audio

    Digital: 18x I2S TDM, DSD512, S/PDIF Tx + Rx, 8 channel PDM Microphone input
    Analog: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input

  • Serial Ports

    4x UART

  • Other Interfaces

    3x 4 Bit wide SDIO 3.0
    SPDIF In/Out
    I2S
    Multichannel Serial-Audio-Interface
    2x I2C
    SPI
    QSPI
    GPIOs
    PWMs
    2x CAN

  • Power Supply

    3.3 VDC

  • Operating System

    Linux Yocto, Debian / Android / Windows 10 IoT

  • Operating Temperature

    -40 ÷  85°C (industrial) / -25  ÷ 85°C (Extended Consumer) / 0 ÷ 70°C (Consumer)

  • Dimensions
    67.6 x 36.7 x 6.4 mm

Documentation

Part Number

  • Trizeps VIII Plus

    Part number description
    搭载恩智浦 i.MX 8M Plus 应用处理器的 SODIMM-200 中央处理器模块
    Contact us for more informations or quotes
    联系我们

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