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Trizeps VII

Name: Trizeps VII
SKU: Trizeps VII

搭载恩智浦 i.MX6 应用处理器的 SODIMM-200 中央处理器模块

Product status

Development

Sampling

Production

Available in Industrial Temperature Range

Data Sheet

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CPU

NXP i.MX6 Applications Processors, Solo up to QuadCore

Graphics

Vivante GC3500 2D accelerator + Vivante GC2000 3D accelerator

Connectivity

1x 100/1000 Megabit Ethernet, WiFi/Bluetooth, USB 2.0, PCIe, HDMI

Memory

Up to 2 GB LPDDR3-1066 RAM memory, 64 Bit

Product details

Technical Info

Description

The Trizeps VII is one of the world‘s most powerful NXP i.MX6 CPU modules and is suitable for multimedia, multitouch and multidisplay applications as well as for demanding control tasks. It uses the full performance potential of the NXP i.MX6 processor with the compact form factor of the SODIMM 200 standard.
Processor

NXP i.MX M6 Family based on ARM® Cortex®-A9 cores
• i.MX 6Solo - 1x Cortex®-A9 core up to 1.0GHz
• i.MX 6DualLite - 2x Cortex®-A9 cores up to 1.0GHz
• i.MX 6Dual - 2x Cortex®-A9 cores up to 1.0GHz
• i.MX 8Quad - 4x Cortex®-A9 cores up to 1.0GHz
Memory

Soldered down LPDDR3-1066 memory up to 2 GB, 64-bit interface
Graphics

Vivante GC3500 2D Hardware accelerator
Vivante GC2000 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
Dedicated Vector Graphics accelerator, supports OpenVG™ (only i.MX 6Dual and i.MX 6Quad)
Supports up to 3 independent displays with i.MX 6Dual and i.MX 6Quad
Supports 2 independent displays with i.MX 6DualLite and i.MX 6Solo
Video Interfaces

HDMI v1.4, 2x LVDS, LCD 24 Bit RGB, MIPI
Video Resolution

LVDS, up to 1920x1200
HDMI, up to 1080p
Mass Storage

Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC
Networking

1x 100 Mbit Ethernet RGMII PHY or 1000 Mbit Ethernet RGMII interface
Optional: WiFi 802.11 a/b/g/n/e/i/h/d/k/r/w, Bluetooth 3.0+ EDR
USB

1x USB 2.0 OTG and 1x USB 2.0 Host
PCI-e

1x PCIe
Audio

AC‘97 Audio Codec with 4/5 wires res. Touch and 4x 12 Bit ADC (2x comparator inputs for battery monitoring); Stereo: Line-in, Mic-in, Speaker-out, Headphone out
Serial Ports

3x UART
Other Interfaces

2x FlexCAN
S-ATAII
2x 4 Bit wide SDIO
RTC
SPDIF
Adress-Data-Bus
2x I2C
2x SPI
GPIOs
2x PWM
Power Supply

3.3 VDC
Operating System

Linux / Android / Windows Embedded Compact 7, 2013, Windows 10 IoT Core
Operating Temperature

-40 ÷ 85°C (industrial) / -25 ÷ 85°C (Extended Consumer) / 0 ÷ 70°C (Consumer)
Dimensions

67.6 x 36.7 x 6.4 mm