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Titan 300 TGL-UP3 AI
不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS
Product status
Contact us for more information and quotes
CPU
11th Gen Intel® Core™ processors and Intel® Celeron® SoCs
Graphics
Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
Connectivity
2x 2.5 GbE, Optional M.2 WWAN and WLAN modules
Memory
Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC
Product details
Technical Info
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Description
不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS -
Processor
- Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP)
- Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, 28W TDP (12W cTDP)
- Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, 28W TDP (12W cTDP)
- Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDP
- Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, with IBECC, 28W TDP (12W cTDP) – Industrial
- Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
- Intel® Core™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
AI Chip: 100+ TOPS inference power - Voyager SDK for effortless deployment of AI applications
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Memory
2x DDR4-3200 SODIMM slots
Up to 64GB (IBECC supported only with Core™ industrial SoCs) -
Graphics
Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities
Support for up to four independent displays at up to 4K60 HDR resolution or one display at 8K resolution -
Video Interfaces
2x Multimode DisplayPort 1.4, on dual DP++ connector
2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode) -
Video Resolution
DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC
HDMI 1.4: up to 4Kx2K 24-30Hz 24bpp -
Mass Storage
On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB
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Networking
2x 2.5 Gigabit Ethernet RJ45 connectors Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included*
Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included*
*Certification upon request -
USB
2x Superspeed USB 10Gbps ports on Dual Type-A sockets
2x Superspeed USB 20Gbps on USB Type-C slots -
Audio
Lineout + MicIn combo TRRS Audio Jack
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Serial Ports
2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector
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Other Interfaces
Optional 2x 12 poles terminal block connectors with the following I/O:
• 8x GPIOs
• 1x I2C
• 1x SPI
• 1x 5V
• 1x 3.3V
• 1x 12V
• 3x GND
Power ON Button
Optional TPM 1.2/2.0 module on-board -
Power Supply
12VDC to 24VDC range, Mega-Fit 2p RA Connector
Coin cell battery for RTC On-Board -
Operating System
Microsoft® Windows 10 IoT Enterprise LTSC 2021
Linux (Kernel ≥ 5.4 version) -
Operating Temperature
Commercial range: 0°C to +40°C, with 0.7m/s airflow**
Extended range: -30°C to +40°C, with 0.7m/s airflow**
**Up to 60°C with scaled down CPU TDP -
Dimensions
199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives)
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