SYS-B08-7

NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
 

Soldered on-board DDR3L memory, 32-bit interface
SYS-B08-BASIC/D: 512MB
SYS-B08-FULL/D: 1GB

Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
24-bit Parallel RGB Connector

LVDS: up to 1366x768 @60Hz, 24bpp
RGB: up to 1920x1080p @60Hz, 24bpp

16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
SYS-B08-FULL/D: 8GB eMMC soldered onboard

SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

1 x USB 2.0 OTG port
3 x USB 2.0 Host ports on standard Type-A socket
1 x USB 2.0 Host port on internal pin header

I2S Audio interface on programmable pin header
S / PDIF interface (In and Out) on programmable pin header

1 x CAN Port reconfigurable as GPIO
2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

2 x I2C dedicated connectors (one reserved for Touch Screen)
6 analog inputs for A/D Conversion
Programmable (*) expansion pin header connector, able to offer:
• CSI interface input (PAL and NTSC formats supported)
• Up to 20 GPIO
• SPI interface
• SPDIF Audio interface
• I2S Audio interface
• CAN interface (TTL level)
• 5 x PWM
• 3 x I2C
• 3 x serial ports (2x RS-232 +1xRS-485 interface)
Embedded Low Power RTC
(*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

+12VDC nominal voltage
+3VDC cabled Coin Cell Battery

Linux
Yocto

0°C ÷ +60°C (Commercial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.