Product details
Technical Info
-
DescriptionThe extremely low power and low cost μQseven Rev. 2.0 Compliant Module with the NXP i.MX 6 Processor features all the processor and integrated native I/O capabilities of the SoC, in compliance with the Qseven standard, at the competitive cost of a proprietary module. This board is supplied with a complete and fully-featured BSP, for easy migration from, and to, the entire i.MX 6 product family, along with dedicated hardware and software development support.
-
Processor
NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
- i.MX6S Solo - Single core up to 1GHz
- i.MX6DL Dual Lite - Dual core up to 1GHz per core -
Max Cores2
-
Memory
Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F
-
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
Supports 2 independent displays -
Video Interfaces
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
HDMI Interface -
Video Resolution
LVDS, resolution up to 1920x1200
HDMI, resolution up to 1080p -
Mass Storage
On-board eMMC drive, up to 8 GB
SD / MMC / SDIO interface
Internal SPI Flash for booting -
Networking
Fast Ethernet (10/100) interface
-
USB
1 x USB OTG interface
1 x USB 2.0 Host interface -
PCI-e
1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
-
Audio
I2S / AC’97 Audio Interface
-
Other Interfaces
On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
- Additional SD interface
- Up to 4 UARTs
- CAN interface
- Watchdog(s)
- I2C interfaces
- PWM outputs
- SPI interface
- Additional Audio interface(*) not all the combinations are allowed simultaneously Power Management Signals
-
Power Supply
+5VDC ± 5%
Optional Low Power RTC -
Operating System
Linux
Yocto -
Operating Temperature
0°C ÷ +60 °C (commercial temp.)*
-40°C ÷ +85°C (Industrial temp.)**Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
-
Dimensions40x70 mm (1.57” x 2.76”)
Documentation
-
Data Sheet
-
Manual
-
Image
Part Number
-
QA75-1110-1000-C0-V
Part number descriptionµQ7-A75-J w/i.MX6 Solo - RAM DDR3L 256MB single chip - eMMC 4GB - RTC Low Power - Comm.TempContact us for more informations or quotes
联系我们 -
QA75-1110-1000-I0-V
Part number descriptionµQ7-A75-J w/i.MX6 Solo - RAM DDR3L 256MB single chip - eMMC 4GB - RTC Low Power - Ind.TempContact us for more informations or quotes
联系我们 -
QA75-2410-1000-C0-V
Part number descriptionµQ7-A75-J w/i.MX6 DualLite - RAM DDR3L 1GB dual chip - eMMC 4GB - RTC Low Power - Comm.TempContact us for more informations or quotes
联系我们