• zh
[Picture] μQ7-962_front
[Picture] μQ7-962_front

SOM-uQ7-MX6

搭载恩智浦 i.MX 6 处理器的 μQseven® 模块

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

Single-, Dual- and Quad- Core (ARM® Cortex® -A9 Cores)

Graphics

2D/3D dedicated graphics processors

Connectivity

4x USB 2.0; 2x Serial ports; CAN Bus

Memory

up to 2GB DDR3L on-board

Product details

Technical Info

  • Description
    SOM-uQ7-MX6 is a Qseven® Rel. 2.0 Compliant Module designed by SECO that offers top computational and graphical performances given by low-power consuming ARM architecture. The board integrates i.MX 6 Multimedia Applications platform from NXP, a multimedia processor integrating a multicore Cortex® A9 ARM Core (up to Quad Core processors), ideal for applications requiring multimedia capabilities and/or high levels of parallel computing. All this comes in the μQseven form factor, just 40x70mm, introduced with the Qseven® specifications Rel. 2.0.
  • Processor

    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    i.MX6S Solo - Single core up to 1GHz
    i.MX6DL Dual Lite - Dual core up to 1GHz per core
    i.MX6D Dual - Dual core up to 1GHz per core
    i.MX6Q Quad - Quad core up to 1GHz per core

  • Max Cores
    4
  • Memory

    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)

  • Graphics

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

  • Video Interfaces

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4

  • Video Resolution

    HDMI, up to 1080p
    LVDS, up to 1920x1200

  • Mass Storage

    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

  • Networking

    Gigabit Ethernet interface

  • USB

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

  • PCI-e

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

     

  • Audio

    I2S / AC’97 Audio Interface

  • Serial Ports

    2 x Serial ports (TTL interface)
    CAN port interface

  • Other Interfaces

    I2C Bus
    SM Bus
    Power Management Signals

  • Power Supply

    +5VDC ± 5%

  • Operating System

    Linux
    Yocto

  • Operating Temperature

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    40x70 mm (μQseven, 1.57” x 2.76”)

Part Number

  • Q962-B120-0000-C1-V

    Part number description
    µQ7-962 w/ i.MX6 DualLite @1GHz - DDR3L 1GB - eMMC 4GB - RTC low power - Comm. Temp
    Contact us for more informations or quotes
    联系我们
  • Q962-C150-0000-I1-V

    Part number description
    µQ7-962 w/ i.MX6 DualLite @800MHz - DDR3L 1GB - eMMC 8GB - RTC low power - Ind. Temp.
    Contact us for more informations or quotes
    联系我们
  • SOM-uQ7-MX6

    Part number description
    µQ7-962 w/ i.MX6 Quad @800MHz - DDR3L 1GB - eMMC 8GB - RTC low power - Ind. Temp.
    Contact us for more informations or quotes
    联系我们
  • Q962-H120-0000-C1-V

    Part number description
    µQ7-962 w/ i.MX6 Quad @1GHz - DDR3L 1GB - eMMC 4GB - RTC low power - Comm. Temp.
    Contact us for more informations or quotes
    联系我们

Related Products

CQ7-A42

Qseven® rel. 2.0 Compliant Carrier Board on 3.5” Form factor

Production

View Product
[Image] Q7 STARTER KIT 2.0
Q7 STARTER KIT 2.0

Cross Platform Starter Kit compatible with both x86 and Arm Rev. 2.0 Qseven® modules: a complete package including the basic components necessary to start developing

Production

View Product
[Picture] Q7 Dev Kit 2.0
Q7 DEV KIT 2.0

Cross Platform Development Kit for Qseven® philosophy, compatible with both x86 and Arm Rev. 2.0 Qseven® modules

Production

View Product
Q962-DISS-1-C-PK

Q7 HEAT SPREADER: µQ7-962 Heat Spreader (PASSIVE) for COMMERCIAL VERSION and Solo & DualLite INDUSTRIAL Packaged

Production

View Product
Q962-DISS-1-I-PK

Q7 HEAT SPREADER: µQ7-962 Heat Spreader (PASSIVE) for Dual & Quad (AUTOMOTIVE & INDUSTRIAL) Packaged

Production

View Product
Q962-DISS-2-C-PK

Q7 HEAT SINK: µQ7-962 Heat Sink (PASSIVE) for COMMERCIAL VERSION and Solo & DualLite INDUSTRIAL Packaged

Production

View Product
Q962-DISS-2-I-PK

µQ7-962 Heat Sink (PASSIVE) for Dual & Quad (AUTOMOTIVE & INDUSTRIAL) Packaged

Production

View Product
ASK-425

Adapter for mounting a microQ7 module on standard Qseven carrier boards

Production

View Product

machcazz