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SOM-SMARC-MX93
SMARC® Rel. 2.1.1 module with NXP i.MX 9 Applications Processors
Product status
Contact us for more information and quotes
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CPU
NXP i.MX 933/935 processor
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Graphics
Display up to FHD
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Memory
Soldered-down LPDDR4X/LPDDR4-3200 memory, up to 2GB total, 16-bit interface
Product details
Technical Info
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Description
SMARC® Rel. 2.1.1 module with NXP i.MX 9 Applications Processors -
Processor
1-2x Arm® Cortex®-A55 @ 1.7 GHz
Arm Cortex-M33 @ 250Mhz
Arm® Ethos™ U-65 microNPU -
Memory
Soldered-down LPDDR4X/LPDDR4-3200 memory, up to 2GB total, 16-bit interface
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Graphics
LVDS Single Channel
MIPI_DSI or eDP interface (factory alternatives) -
Video Interfaces
LVDS Single Channel
MIPI_DSI or eDP interface (factory alternatives) -
Video Resolution
MIPI-DSI: up to 1080p60
LVDS: up to 720p60 -
Mass Storage
eMMC 5.1 Drive soldered on-board, up to 64GB (boot device)
SD 4-bit interface (boot device) -
Audio
1x I2S port
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Serial Ports
2x UART (4-wires)
2x UART (2-wires) -
CAN Bus
2x CAN interfaces
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Other Interfaces
12 x GPIOs
1x MIPI-CSI 2 Lanes Camera interface
1x General Purpose I2C Bus
2 x PWM ports -
Power Supply
+5VDC ± 5% and +3.3V_RTC
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Operating System
Linux
Yocto -
Operating Temperature
0 to +60°C (Commercial Range)
-40 to +85°C (Industrial Range)*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
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Dimensions
82 x 50 mm
Documentation
Part Number
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SOM-SMARC-MX93
Part number descriptionSMARC® Rel. 2.1.1 module with NXP i.MX 9 Applications ProcessorsContact us for more informations or quotes
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