Product details
Technical Info
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Description搭载恩智浦 i.MX 8X 应用处理器的 SMARC®Rel. 2.1.1 模块
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Processor
NXP i.MX 8X family SoCs: Dual or Quad ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing
- NXP i.MX8 QuadXplus, 4x ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing
- NXP i.MX8 DualXplus, 2x ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing
- NXP i.MX8 DualX, 2x ARM Cortex®-A35 Cores
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Max Cores4+1
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Memory
Soldered down LPDDR4 memory @ 1200MHz, 32-bit interface, up to 4GB
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Graphics
Embedded GC7000Lite GPU
Supports OpenGL 3.0, 2.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and 1.1, OpenVG 1.1, and Vulkan
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV10, VP8, H.263 and MPEG4.2t, HW encoding of AVC/H.264
2 independent displays supported
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Video Interfaces
Factory alternatives:
· 2x LVDS / Mipi-DSI Single Channel or 1xLVDS / Mipi-DSI Dual Channel 18-/24-bit interface
· LVDS / Mipi-DSI Single Channel 18-/24-bit interface + HMDI interface
· eDP 4-lane interface + LVDS / Mipi-DSI single Channel 18-/24-bit interface
· eDP 4-lane interface + HMDI interface
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Video Resolution
MIPI-DSI, LVDS, eDP, HDMI: Up to 1920 x 1080 @ 60Hz
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Mass Storage
Optional Soldered onboard eMMC 5.1 Drive, up to 64GB
SD 4-bit interface
QSPI NOR Flash soldered on-board
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Networking
Up to 2 x Gigabit Ethernet interfaces
On-board WiFi 802.11 a/b/g/n + BT LE 5.0 module, optional
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USB
Up to 3 x USB 2.0 Host Ports
2 x USB 3.0 Host Ports
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PCI-e
1x PCI-e 3.0 x1 port
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Audio
Up to 2x I2S Audio interfaces
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Serial Ports
2x 2-wires UART
2x 4-wires UART
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CAN Bus
2x CAN interfaces
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Other Interfaces
1x 4-lanes CSI camera interface
2x PWM
Up to 14x GPIOs
I2C bus
SM bus
SPI interface
QuadSPI interface
Watchdog
Boot select signals
Power Management Signals
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Power Supply
+5VDC and +3.3V_RTC
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Operating System
Linux
Android
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Operating Temperature
0°C ÷ +60°C ** (Commercial version)
-40°C ÷ +85°C (Industrial version)
**Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.
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Dimensions50 x 82 mm (1.97” x 3.23”)
Documentation
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Image
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Data Sheet
Part Number
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SOM-SMARC-MX8X
Part number description搭载恩智浦 i.MX 8X 应用处理器的 SMARC®Rel. 2.1.1 模块Contact us for more informations or quotes
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