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SOM-SMARC-MX8X

搭载恩智浦 i.MX 8X 应用处理器的 SMARC®Rel. 2.1.1 模块

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

NXP i.MX 8X Applications Processors

Graphics

Integrated GPU, supports 2 independent displays

Connectivity

2x Gigabit Ethernet; opt. Wi-Fi +BT 5.0; CSI camera; 2x USB 3.0; 3x USB2.0; 1x PCI-e x1; 2x CAN Bus; 4xUART; 14x GPI/Os; QuadSPI interface

Memory

up to 4GB soldered down LPDDR4-2400 memory

Product details

Technical Info

  • Description
    搭载恩智浦 i.MX 8X 应用处理器的 SMARC®Rel. 2.1.1 模块
  • Processor

    NXP i.MX 8X family SoCs: Dual or Quad ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing

    • NXP i.MX8 QuadXplus, 4x ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing
    • NXP i.MX8 DualXplus, 2x ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing
    • NXP i.MX8 DualX, 2x ARM Cortex®-A35 Cores
  • Max Cores
    4+1
  • Memory

    Soldered down LPDDR4 memory @ 1200MHz, 32-bit interface, up to 4GB

  • Graphics

    Embedded GC7000Lite GPU

    Supports OpenGL 3.0, 2.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and 1.1, OpenVG 1.1, and Vulkan

    Embedded VPU,  supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV10, VP8, H.263 and MPEG4.2t, HW encoding of AVC/H.264

    2 independent displays supported

  • Video Interfaces

    Factory alternatives:

    · 2x LVDS / Mipi-DSI Single Channel or 1xLVDS / Mipi-DSI Dual Channel 18-/24-bit interface

    · LVDS / Mipi-DSI Single Channel 18-/24-bit interface + HMDI interface

    · eDP 4-lane interface + LVDS / Mipi-DSI single Channel 18-/24-bit interface

    · eDP 4-lane interface + HMDI interface

  • Video Resolution

    MIPI-DSI, LVDS, eDP, HDMI: Up to 1920 x 1080 @ 60Hz

  • Mass Storage

    Optional Soldered onboard eMMC 5.1 Drive, up to 64GB

    SD 4-bit interface

    QSPI NOR Flash soldered on-board

  • Networking

    Up to 2 x Gigabit Ethernet interfaces

    On-board WiFi 802.11 a/b/g/n + BT LE 5.0 module, optional

  • USB

    Up to 3 x USB 2.0 Host Ports

    2 x USB 3.0 Host Ports

  • PCI-e

    1x PCI-e 3.0 x1 port

  • Audio

    Up to 2x I2S Audio interfaces

  • Serial Ports

    2x 2-wires UART

    2x 4-wires UART

  • CAN Bus

    2x CAN interfaces

  • Other Interfaces

    1x 4-lanes CSI camera interface

    2x PWM

    Up to 14x GPIOs

    I2C bus

    SM bus

    SPI interface

    QuadSPI interface

    Watchdog

    Boot select signals

    Power Management Signals

  • Power Supply

    +5VDC and +3.3V_RTC

  • Operating System

    Linux

    Android

  • Operating Temperature

    0°C ÷ +60°C ** (Commercial version)

    -40°C ÷ +85°C (Industrial version)

     

    **Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.

  • Dimensions
    50 x 82 mm (1.97” x 3.23”)

Part Number

  • SOM-SMARC-MX8X

    Part number description
    搭载恩智浦 i.MX 8X 应用处理器的 SMARC®Rel. 2.1.1 模块
    Contact us for more informations or quotes
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