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SOM-SMARC-MX8M-Plus

搭载恩智浦 i.MX 8M Plus 应用处理器的 SMARC®Rel. 2.1.1 模块

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

NXP i.MX 8M Plus Applications Processors

Graphics

Integrated GPU, supports 3 independent displays

Connectivity

2x Gigabit Ethernet; opt. Wi-Fi +BT 5.0; 2x CSI camera; 2x USB 3.0; 3x USB2.0; 1x PCI-e x1; 2x CAN Bus; 4xUART; 14x GPI/Os; QuadSPI interface

Memory

up to 6GB soldered down LPDDR4-4000 memory

Product details

Technical Info

  • Description
    搭载恩智浦 i.MX 8M Plus 应用处理器的 SMARC®Rel. 2.1.1 模块
  • Processor

    NXP i.MX 8M Plus family SoCs: Dual or Quad ARM Cortex®-A53 Cores + general purpose Cortex® M7 800MHz processor

    • NXP i.MX 8M Plus Quad, 4x ARM Cortex®-A53 Cores up to 1.8GHz

    • NXP i.MX 8M Plus Dual, 2x ARM Cortex®-A53 Cores up to 1.8GHz

    • NXP i.MX 8M Plus Quad Lite, 4x ARM Cortex®-A53 Cores up to 1.8GHz, no VPU / NPU

     

    NPU: 2.3 TOPS Neural Network performance (not for Quad Lite)

  • Max Cores
    4+1
  • Memory

    Soldered down LPDDR4-4000 memory, 32-bit interface, up to 6GB

  • Graphics

    Integrated Graphics Processing Unit GC7000UL, supports 3 independent displays.

    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-4, MPEG-2, MVC, VC-1, RV, VP6, VP7, VP8, VP9, JPEG, HW encoding of HEVC/H.265, AVC/H.264

    Supports OpenVG 1.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and Vulkan

  • Video Interfaces

    Up to 3 video display interfaces

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4/1.3

    2xLVDS Single Channel / 1xLVDS Dual Channel or eDP + 1xLVDS Single Channel (factory alternatives)

  • Video Resolution

    HDMI: Up to  3840 x 2160 @30
    LVDS/eDP: Up to 1920 x 1080 @60

  • Mass Storage

    Soldered onboard eMMC 5.1 Drive, up to 64GB

    SD 4-bit interface

  • Networking

    Up to 2 x Gigabit Ethernet interfaces

    Optional WiFi + BT LE module onboard

  • USB

    2 x USB 2.0 Host Ports

    2 x USB 3.0 Host Ports

    1 x USB 2.0 Host/Client port

  • PCI-e

    Up to 1x PCI-e x1 Gen3 port

  • Audio

    Up to 2x I2S Audio interfaces

  • Serial Ports

    2x 2-wires UART

    2x 4-wires UART

  • CAN Bus

    2x CAN interfaces

  • Other Interfaces

    1x 4-lanes CSI camera interface

    1x 2-lanes CSI camera interface

    2x PWM

    Up to 14x GPIOs

    I2C bus

    SM bus

    SPI interface

    QuadSPI interface

    Watchdog

    Boot select signals

    Power Management Signals

  • Power Supply

    +5VDC ± 5% and +3.3V_RTC

  • Operating System

    Linux

  • Operating Temperature

    0°C ÷ +60°C ** (Commercial version)

    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

     

    **Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.

  • Dimensions
    50 x 82 mm (1.97” x 3.23”)

Part Number

  • SOM-SMARC-MX8M-Plus

    Part number description
    搭载恩智浦 i.MX 8M Plus 应用处理器的 SMARC®Rel. 2.1.1 模块
    Contact us for more informations or quotes
    联系我们

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