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SOM-SMARC-MX8M

搭载恩智浦 i.MX 8M 应用处理器的 SMARC®Rel. 2.1.1 模块

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

NXP i.MX 8M Applications Processors

Graphics

Integrated Graphics Processing Unit, supports 2 independent displays

Connectivity

WiFi + BT LE; CSI camera; QuadSPI interface; 14x GPI/Os

Memory

Up to 4GB soldered down LPDDR4-3200 memory, 32-bit interface.

Product details

Technical Info

  • Description
    The SOM-SMARC-MX8M is a SMARC Rel. 2.1.1 compliant module with NXP i.MX 8M Applications Processors. Featuring multicore processing (Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor) and 4Kp60 HEVC decoding with HDR, it is a scalable solution designed by SECO for home automation, transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time response.
  • Processor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
     i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    • i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
     i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

  • Memory

    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB

  • Graphics

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

  • Video Interfaces

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4

    18- / 24-bit Dual Channel LVDS interface (factory option)

  • Video Resolution

    HDMI Up to 4096 x 2160 @ 60 (4K)

    LVDS Up to 1920 x 1080 @ 60Hz

  • Mass Storage

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board

  • Networking

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

  • USB

    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port

  • PCI-e

    2x PCI-e x1 ports

  • Audio

    I2S Audio Interface

  • Serial Ports

    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)

  • Other Interfaces

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    14 x GPI/Os
    Boot select signals
    Power Management Signals

  • Power Supply

    +5VDC
    +3.3V_RTC

  • Operating System

    Linux
    Yocto
    Android

  • Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    50 x 82 mm (1.97” x 3.23”)

Part Number

  • RC12-5520-2311-I2-V

    Part number description
    SM-C12 i.MX8M Quad 1.3 GHz (VPU decode + HDR10 + GPU), LPDDR4 2 GB, eMMC 8 GB, LVDS + HDMI, WIFI(WL1837) + BT, PCIe, CAN, Ind. Temp
    Contact us for more informations or quotes
    联系我们
  • RC12-5530-2112-I2-V

    Part number description
    SM-C12 i.MX8M Quad 1.3 GHz (VPU decode + HDR10 + GPU), LPDDR4 2 GB, eMMC 16 GB, LVDS + HDMI, uSD + UART4, PCIe, NO CAN/ NO RTC (SPI0 su carrier), Ind. Temp
    Part number configuration

    SM-C12 i.MX8M Quad 1.3 GHz (VPU decode + HDR10 + GPU), LPDDR4 2 GB, eMMC 16 GB, LVDS + HDMI, uSD + UART4, PCIe, NO CAN/ NO RTC (SPI0 su carrier), Ind. Temp

    Contact us for more informations or quotes
    联系我们

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