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SOM-SMARC-ASL

符合SMARC® Rel 2.1标准的模块,采用用于Edge应用的Intel Atom® x7000RE系列处理器

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

Intel Atom® x7000RE系列处理器(代号:Amston Lake),针对工业物联网应用

Graphics

2 x NBase-T(支持2.5GbE);6x 高速USB;2x USB 10Gbps;4x PCI-e Gen3通道,带可选的SERDES

Connectivity

2 x NBase-T(支持2.5GbE);6x 高速USB;2x USB 10Gbps;4x PCI-e Gen3通道,带可选的SERDES

Memory

最多16GB的LPDDR5-4800焊接内存,带IBECC(带内错误校正码)

Product details

Technical Info

  • Description
    符合SMARC® Rel 2.1标准的模块,采用用于Edge应用的Intel Atom® x7000RE系列处理器
  • Processor

    Intel Atom® Processors x7000RE Series (Codename: Amston Lake)

    • Intel Atom® processor x7211RE, 2 cores @1 GHz (3.2 GHz turbo), 6W TDP, with TSN and TCC*
    • Intel Atom® processor x7213RE, 2 cores @2 GHz (3.4 GHz turbo), 9W TDP, with TSN and TCC*
    • Intel Atom® processor x7433RE, 4 cores @1.5 GHz (3.4 GHz turbo), 9W TDP, with TSN and TCC*
    • Intel Atom® processor x7835RE, 8 cores @1.3 GHz (3.6 GHz turbo), 12W TDP, with TSN and TCC*

    * Time Sensitive Network and Time Coordinate Computing

  • Max Cores
    8
  • Memory

    Up to 16GB LPDDR5-4800 soldered down memory with IBECC (In-Band Error Correction Code)

  • Graphics

    Integrated Intel® UHD Graphics driven by Intel® Xe architecture:

    • Intel Atom® processor x7211RE with 16 Execution Units
    • Intel Atom® processor x7213RE with 16 Execution Units
    • Intel Atom® processor x7433RE with 32 Execution Units
    • Intel Atom® processor x7835RE with 32 Execution Units
  • Video Interfaces

    eDP 1.3 or dual channel 18/24bit LVDS interface (factory alternatives)

    2x DP++ multimode DP 1.4 / HDMI® 2.1 interface

    2x MIPI CSI-2 inputs (1 x 2-lanes and 1 x 4-lanes)

  • Video Resolution

    Up to 4096x2160 @60Hz

  • Mass Storage

    1x external S-ATA Gen3.2 channel
    Optional eMMC 5.1 drive soldered on-board

  • Networking

    2x NBase-T ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports

    Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane)

  • USB

    6x Hi-Speed USB interfaces

    2x USB 10Gbps interfaces

  • PCI-e

    4x PCIe lanes Gen3

    Possible channel aggregations:

    • 4 ports x1 lanes (4x1)
    • 1 port x2 lanes + 2 ports x1 lane (1x2 + 2x1) or SERDES in place of fourth PCIe lane
  • Audio

    HD audio and Soundwire / i2S audio interfaces

  • Serial Ports

    2x UARTs

    2x HS-UARTs

  • Other Interfaces

    Up to 14x GPIOs

    SM bus

    I2C bus

    1x SPI interface for boot

    1x General Purpose SPI or eSPI (factory alternatives)

    Power management signals

    Watchdog

  • Power Supply

    +5VDC and +3VDC for RTC

  • Operating System

    Microsoft® Windows 10

    Linux Kernel LTS

  • Operating Temperature

    -40°C ÷ +85°C (Industrial version) *

     

    * Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    50 x 82 mm

Documentation

  • Data Sheet