
SOM-SMARC-ASL
符合SMARC® Rel 2.1标准的模块,采用用于Edge应用的Intel Atom® x7000RE系列处理器
Product status
Contact us for more information and quotes

CPU
Intel Atom® x7000RE系列处理器(代号:Amston Lake),针对工业物联网应用

Graphics
2 x NBase-T(支持2.5GbE);6x 高速USB;2x USB 10Gbps;4x PCI-e Gen3通道,带可选的SERDES

Connectivity
2 x NBase-T(支持2.5GbE);6x 高速USB;2x USB 10Gbps;4x PCI-e Gen3通道,带可选的SERDES

Memory
最多16GB的LPDDR5-4800焊接内存,带IBECC(带内错误校正码)
Product details
Technical Info
-
Description
符合SMARC® Rel 2.1标准的模块,采用用于Edge应用的Intel Atom® x7000RE系列处理器 -
Processor
Intel Atom® Processors x7000RE Series (Codename: Amston Lake)
- Intel Atom® processor x7211RE, 2 cores @1 GHz (3.2 GHz turbo), 6W TDP, with TSN and TCC*
- Intel Atom® processor x7213RE, 2 cores @2 GHz (3.4 GHz turbo), 9W TDP, with TSN and TCC*
- Intel Atom® processor x7433RE, 4 cores @1.5 GHz (3.4 GHz turbo), 9W TDP, with TSN and TCC*
- Intel Atom® processor x7835RE, 8 cores @1.3 GHz (3.6 GHz turbo), 12W TDP, with TSN and TCC*
* Time Sensitive Network and Time Coordinate Computing
-
Max Cores
8 -
Memory
Up to 16GB LPDDR5-4800 soldered down memory with IBECC (In-Band Error Correction Code)
-
Graphics
Integrated Intel® UHD Graphics driven by Intel® Xe architecture:
- Intel Atom® processor x7211RE with 16 Execution Units
- Intel Atom® processor x7213RE with 16 Execution Units
- Intel Atom® processor x7433RE with 32 Execution Units
- Intel Atom® processor x7835RE with 32 Execution Units
-
Video Interfaces
eDP 1.3 or dual channel 18/24bit LVDS interface (factory alternatives)
2x DP++ multimode DP 1.4 / HDMI® 2.1 interface
2x MIPI CSI-2 inputs (1 x 2-lanes and 1 x 4-lanes)
-
Video Resolution
Up to 4096x2160 @60Hz
-
Mass Storage
1x external S-ATA Gen3.2 channel
Optional eMMC 5.1 drive soldered on-board -
Networking
2x NBase-T ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports
Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane)
-
USB
6x Hi-Speed USB interfaces
2x USB 10Gbps interfaces
-
PCI-e
4x PCIe lanes Gen3
Possible channel aggregations:
- 4 ports x1 lanes (4x1)
- 1 port x2 lanes + 2 ports x1 lane (1x2 + 2x1) or SERDES in place of fourth PCIe lane
-
Audio
HD audio and Soundwire / i2S audio interfaces
-
Serial Ports
2x UARTs
2x HS-UARTs
-
Other Interfaces
Up to 14x GPIOs
SM bus
I2C bus
1x SPI interface for boot
1x General Purpose SPI or eSPI (factory alternatives)
Power management signals
Watchdog
-
Power Supply
+5VDC and +3VDC for RTC
-
Operating System
Microsoft® Windows 10
Linux Kernel LTS
-
Operating Temperature
-40°C ÷ +85°C (Industrial version) *
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
-
Dimensions
50 x 82 mm