Product details
Technical Info
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Description搭载 AMD 锐龙™嵌入式 V2000 SoC 的 COM Express® 3.0 紧凑型 6 型模块
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Processor
- AMD Ryzen™ Embedded V2748 with AMD Radeon™ Graphics with 7CU, Eight Core Dual Thread @ 2.9GHz (4.15 Boost), TDP 35-54W
- AMD Ryzen™ Embedded V2718 with AMD Radeon™ Graphics with 7CU, Eight Core Dual Thread @ 1.7GHz (4.15 Boost), TDP 10-25W
- AMD Ryzen™ Embedded V2546 with AMD Radeon™ Graphics with 6 CU, Six Core Dual Thread @ 3GHz (3.95 Boost), TDP 35-54W
- AMD Ryzen™ Embedded V2516 with AMD Radeon™ Graphics with 6 CU, Six Core Dual Thread @ 2.1GHz (3.95 Boost), TDP 10-25W
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Max Cores8
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Memory
Two DDR4 SO-DIMM Slots supporting DDR4-3200, ECC and non- ECC modules
Memory, up to 64GB
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Graphics
AMD Radeon™ Graphics GPU with up to 7 Compute Units
Up to 4 independent displays supported
Support DirectX 12, OpenGL 4.6, OpenCL 2.1 and Vulkan
HW accelerated Video Decode VP9 (8 and 10 bits), H.264/AVC (8bits), H.265/HEVC (8 and 10
bits), JPEG
HW accelerated Video Encode H.264/AVC (8bits), H.265/HEVC (8 and 10 bits), JPEG
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Video Interfaces
Up to 3 x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1
1 x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface
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Video Resolution
eDP, DP up to 4096x2160 @60Hz 10b with DSC 1.2 (HBR3)
HDMI up to 4096x2160 @ 60Hz
LVDS up to 1920x1200 @ 60Hz
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Mass Storage
2 x S-ATA Gen3 Channels
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Networking
Gigabit Ethernet interface with Intel® I21x GbE Controller
Optional M.2 1216 WiFi 802.11ac and BTLE 5.0 on-board
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USB
1 x SuperSpeed USB 10Gbps Host ports
3 x SuperSpeed USB 5Gbps Host ports
8 x 2.0 Host ports
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PCI-e
8 x PCI-e x1 Gen3 lanes
PCI-express Graphics (PEG) x8 Gen3
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Audio
HD Audio interface
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Serial Ports
2 x UARTs
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Other Interfaces
SPI, I2C, SM Bus, Thermal Management, FAN management
LPC bus
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4 x GPI, 4 x GPO
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Power Supply
+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
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Operating System
Microsoft® Windows 10
Linux -
Operating Temperature
0°C ÷ +60°C (Commercial version)*
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will depend on the application, enclosure, and/or environment. Each customer must consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
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Dimensions95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)
Documentation
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Data Sheet
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Image