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SOM-COMe-CT6-TGL-U

搭载第11代英特尔®酷睿™(原名 Tiger Lake UP3)处理器的 COM Express®Rel. 3.0 紧凑型 6 型模块

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

Intel® Core™ Series (formerly Tiger Lake UP3) Processors

Graphics

Integrated Intel® Iris® Xe Graphics, up to 96 Execution Units

Connectivity

1x GbE; 4x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x4 Gen4

Memory

Two DDR4 SO-DIMM Slots supporting DDR4-3200 IBECC memory, up to 64GB

Product details

Technical Info

  • Description
    搭载第11代英特尔®酷睿™(原名 Tiger Lake UP3)处理器的 COM Express®Rel. 3.0 紧凑型 6 型模块
  • Processor

    Intel® Core™ i7-1185G7E, Quad Core @2.8GHz (4.4GHz Turbo Boost), 12MB Cache, 28W TDP (12W cTDP), with Hyperthreading
    Intel® Core™ i5-1145G7E, Quad Core @2.6GHz (4.1GHz Turbo Boost), 8MB Cache, 28W TDP (12W cTDP), with Hyperthreading
    Intel® Core™ i3-1115G4E, Dual Core @3.0GHz (3.9GHz Turbo Boost), 6MB Cache, 28W TDP (12W cTDP), with Hyperthreading
    Intel® Core™ i7-1185GRE, Quad Core @2.8GHz (4.4GHz Turbo Boost), 12MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial
    Intel® Core™ i5-1145GRE, Quad Core @2.6GHz (4.1GHz Turbo Boost), 8MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial
    Intel® Core™ i3-1115R4E, Dual Core @3.0GHz (3.9GHz Turbo Boost), 6MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial

  • Chipset

    Integrated Intel® PCH-LP

  • Memory

    Two DDR4 SO-DIMM slots supporting DDR4-3200 memory, up to 64GB
    IBECC DDR4 memory modules supported only with Intel® Core™ Industrial SoCs

  • Graphics

    Intel® Iris® Xe Graphics, up to 96 Execution Units Up to 4 independent displays supported
    Support DirectX 12, OpenGL 4.6, OpenCL 3.0 and Vulkan 1.2 HW accelerated video decode AVC/H.264, HEVC/H.265, VP81, VP9, AV1
    HW accelerated video encode AVC/H.264, HEVC/H.265, VP81, VP9

  • Video Interfaces

    Up to 3x Digital Display Interfaces (DDIs), supporting DP 1.2, eDP 1.4, HDMI 1.4, DVI
    1 x eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface 1 x VGA interface

  • Video Resolution

    eDP, DP: up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz 30bpp with DSC
    HDMI: up to 4096x2160 @24Hz, 24bpp
    LVDS: up to 1920x1200 @60Hz
    VGA: up to 2048 x 1536 @50Hz

  • Mass Storage

    2x SATA Gen3 channels
    2x PCI-e x4 ports available for M.2 NVMe drives

  • Networking

    Gigabit Ethernet interface
    Intel® I225 GbE controller

  • USB

    4x SuperSpeed USB 5Gbps host ports
    8x USB 2.0 Host ports

  • PCI-e

    8x PCI-e x1 Gen3 lanes
    PCI-express Graphics (PEG) x4 Gen4

  • Audio

    HD audio interface

  • Serial Ports

    2x UARTs

  • Other Interfaces

    SPI, I2C, SM bus, thermal management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4x GPO

  • Power Supply

    +12VDC ± 10%, +5VSB (optional), +3VRTC (optional)

  • Operating System

    Microsoft® Windows 10
    Microsoft® Windows 10 IoT Core
    Linux

  • Operating Temperature

    0°C ÷ +60°C (Commercial)
    -40°C ÷ +85°C (Industrial)

     

    Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)

Part Number

  • SOM-COMe-CT6-TGL-U

    Part number description
    搭载第11代英特尔®酷睿™(原名 Tiger Lake UP3)处理器的 COM Express®Rel. 3.0 紧凑型 6 型模块
    Contact us for more informations or quotes
    联系我们

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