Product details
Technical Info
-
Description采用Intel Atom® x7000E系列处理器(代号:Amston Lake和Alder Lake N)的COM Express® 3.1 Type 6紧凑型模块
-
Processor
Intel® Atom® Processors x7000RE (Codename: Amston Lake) Series:
- Intel Atom® x7835RE Eight Core @ 1.3GHz (3.6GHz turbo) 12W TDP w/ TSN and TCC, industrial
- Intel Atom® x7433RE Quad Core @ 1.5GHz (3.4GHz turbo) 9W TDP w/ TSN and TCC, industrial
- Intel Atom® x7213RE Dual Core @ 2GHz (3.4GHz turbo) 9W TDP w/ TSN and TCC, industrial
- Intel Atom® x7211RE Dual Core @ 1GHz (3.2GHz turbo) 6W TDP w/ TSN and TCC, industrial
Intel Atom® Processors x7000E (Codename: Alder Lake N) Embedded E Series:
- Intel Atom® x7425E Quad Core @1.5GHz (3.4GHZ turbo) 12W TDP w/ TSN and TCC, commercial
- Inte Atom® x7213E Dual Core @1.7GHz (3.2GHZ turbo) 10W TDP w/ TSN and TCC, commercial
- Intel Atom® x7211E Dual Core @1GHz (3.2GHZ turbo) 6W TDP w/ TSN TCC, commercial
Intel® Core™ i3 Processors and Intel® Processor N Series (Codename: Alder Lake N) PC Client Processors
- Intel® Core™ i3-N305 Eight Core @1GHz / 1.8GHz (3.8GHZ turbo) 9W/15W TDP w/o TSN and w/o TCC, commercial
- Intel® Processor N200 Quad Core @1GHz (3.7GHZ turbo) 6W TDP w/o TSN and w/o TCC, commercial
- Intel® Processor N97 Quad Core @2GHz (3.6GHZ turbo) 12W TDP w/o TSN and w/o TCC, commercial
- Intel® Processor N50 Dual Core @1GHz (3.4GHZ turbo) 6W TDP w/o TSN and w/o TCC, commercial
(*) TCC: Time Coordinated Computing
(**) TSN: Time Sensitive Networking -
Max Cores8
-
Memory
One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up to 16GB
-
Graphics
Integrated Intel® Gen12 UHD graphics controller with up to 32 EU
Support up to 3 independent displays -
Video Interfaces
2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP Alt-Mode over Type-C
1x DDI Interface supporting DP / HDMI®
1x eDP or Single/Dual-Channel 18-/24-bit LVDS interface (factory alternatives) -
Video Resolution
HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b
DP 1.4, eDP 1.4: 4096x2304@60 Hz
LVDS up to 1920x1200 @ 60Hz -
Mass Storage
Up to 2x S-ATA Gen3 channels
Optional eMMC 5.1 drive soldered on-board -
Networking
1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, supporting 2.5GbE and TSN
-
USB
Up to 2x USB 10Gbps
Optional 3x USB 5Gbps
8x Hi-Speed USB ports -
PCI-e
Up to 6x PCI-e Gen3 lanes
-
Audio
HD Audio interface
SoundWire Interface -
Serial Ports
2x UARTs
-
Other Interfaces
SPI, 2x I2C, SM Bus, Thermal Management, FAN management
Optional eSPI or LPC bus (factory alternatives)
Optional TPM 1.2/2.0 on-board
LID#/SLEEP#/PWRBTN#, watchdog
4x GPI, 4x GPO
Optional 2x CSI camera interfaces -
Power Supply
+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
-
Operating System
Microsoft® Windows 10 IoT Enterprise 2019 LTSC
Microsoft® Windows 10 IoT Enterprise 2021 LTSC
Edgehog OS (Yocto) -
Operating Temperature
0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version)* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
-
Dimensions95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)