Product details
Technical Info
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Description搭载英特尔®至强® D-1700 处理器(原名 Ice Lake-D)的 COM Express® 3.0 基本型 7 型模块
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Processor
Intel Xeon® D-1700 family of processors
Up to 10 cores, ~40 to 67W thermal design power (TDP) -
Memory
Up to four DDR4 SODIMM slots on three DDR4 72-bit channels (up to 2x SODIMM slots on channel #0)
Supporting DDR4-2400/2666/2933 memory (both ECC and non-ECC supported), up to 128GB
Supports single-rank or dual-rank per SODIMM module -
Mass Storage
2x SATA 3 channels
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Networking
- 1x Gigabit Ethernet LAN port with NC-SI (Network Controller Sideband Interface) functionality, managed by an Intel® I21x Gigabit Ethernet Controller.
- 4x 10Gigabit Ethernet interfaces (10GBASE-KR), directly managed by the Xeon® D-1700 SoCs.
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USB
4x Superspeed USB 5Gbps
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PCI-e
16x PCI-e Gen4 lanes (up to 4x root ports)
16x PCI-e Gen3 lanes (up to 8x root ports) -
Serial Ports
2x legacy UARTs, 16C550 compatible
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Other Interfaces
I2C, SPI, SM Bus, LPC/eSPI bus
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Power Supply
+12VDC ± 10% and +5VSB (optional)
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Operating System
Windows 10 IoT Enterprise
Windows Server
Wind River VxWorks
Yocto Project Linux
Linux LTS Kernel -
Operating Temperature
0°C ÷ +60°C (Commercial version)
-40°÷+85°C (Industrial version)*Measured at any point of SECO standard heatspreader for this product, during
any and all times (including start-up). Actual temperature will widely depend on
application, enclosure and/or environment. Upon customer to consider applicationspecific
cooling solutions for the final system to keep the heatspreader temperature
in the range indicated. -
Dimensions120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout)
Documentation
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Data Sheet
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Image
Part Number
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SOM-COMe-BT7-ICL-D
Part number description搭载英特尔®至强® D-1700 处理器(原名 Ice Lake-D)的 COM Express® 3.0 基本型 7 型模块Contact us for more informations or quotes
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