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SOM-COMe-BT6-RPL-P
COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)
Product status
Contact us for more information and quotes
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CPU
13th Gen Intel® Processors targeted for IoT Applications
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Graphics
embedded Intel® Iris® Xe graphics with up to 96 execution units
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Connectivity
1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4.
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Memory
Two DDR5 SO-DIMM Slots supporting DDR5-4800 IBECC Memory, up to 64GB
Product details
Technical Info
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Description
COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P) -
Processor
13th Generation Intel® Processors (Raptor Lake-P)
· Intel® Core™ i7 13800HRE, 14 Core 6P+8E, 45W TDP
· Intel® Core™ i5 1250PRE, 12 Core 4P+8E, 28W TDP
· Intel® Core™ i3 1315URE, 6 Core 2P+4E, 15W TDP
· Intel® Core™ i7 13800HE, 14 Core 6P+8E, 45W TDP
· Intel® Core™ i5 1350PE, 12 Core 4P+8E, 28W TDP
· Intel® Core™ i3 1315UE, 6 Core 2P+4E, 15W TDP
Intel® Processor U300E, 5 Core 1P+4E, 15W TDP
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Memory
Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB
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Graphics
Integrated Gen12 UHD Graphics
· Intel® Core™ i7: Iris® Xe with 96 Execution Units
· Intel® Core™ i5: Iris® Xe with 80 Execution Units
· Intel® Core™ i3: Iris® Xe with 64 Execution Units
· Intel® Processor U300E: Iris® Xe with 48 Execution Units
Improved image (IPU6EP) and video processing (AV1/GNA 3.0)
Support up to 4 independent displays @ 4K
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Video Interfaces
Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1
1x VGA (factory option)
1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives)
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Video Resolution
HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge
eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1)
LVDS up to 1920x1200 @ 60Hz
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Mass Storage
2x SATA Gen3 channels
Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4)
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Networking
1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported.
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USB
Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation)
4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation)
8x USB 2.0 host ports
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PCI-e
Up to 8x PCI-e x1 Gen3 lanes
1x PCI-express Graphics (PEG) x8 Gen4
Up to 2x PCI-express Graphics (PEG) x4 Gen4
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Audio
HD audio and Soundwire/i2S audio interfaces
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Serial Ports
2x UARTs
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Other Interfaces
SPI, I2C, SM Bus, Thermal Management, FAN management
Optional eSPI or LPC bus (factory alternatives)
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4 x GPI, 4 x GPO
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Power Supply
+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
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Operating System
Microsoft® Windows 10
Linux Ubuntu
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Operating Temperature
0°C to +60°C (commercial version)*
-40°C to +85°C (industrial version)*
*Measured at any point of SECO standard heatspreader for this product, during
any and all times (including start-up). Actual temperature will widely depend on
application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature
in the range indicated.
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Dimensions
125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout)
Documentation
Part Number
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SOM-COMe-BT6-RPL-P
Part number descriptionCOM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)Contact us for more informations or quotes
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