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SOM-COMe-BT6-RPL-P

COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

13th Gen Intel® Processors targeted for IoT Applications

Graphics

embedded Intel® Iris® Xe graphics with up to 96 execution units

Connectivity

1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4.

Memory

Two DDR5 SO-DIMM Slots supporting DDR5-4800 IBECC Memory, up to 64GB

Product details

Technical Info

  • Description
    COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)
  • Processor

    13th Generation Intel® Processors (Raptor Lake-P)

    ·       Intel® Core™ i7 13800HRE, 14 Core 6P+8E, 45W TDP

    ·       Intel® Core™ i5 1250PRE, 12 Core 4P+8E, 28W TDP

    ·       Intel® Core™ i3 1315URE, 6 Core 2P+4E, 15W TDP

    ·       Intel® Core™ i7 13800HE, 14 Core 6P+8E, 45W TDP

    ·       Intel® Core™ i5 1350PE, 12 Core 4P+8E, 28W TDP

    ·       Intel® Core™ i3 1315UE, 6 Core 2P+4E, 15W TDP

    Intel® Processor U300E, 5 Core 1P+4E, 15W TDP

  • Memory

    Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB

  • Graphics

    Integrated Gen12 UHD Graphics

    ·         Intel® Core™ i7: Iris® Xe with 96 Execution Units

    ·         Intel® Core™ i5: Iris® Xe with 80 Execution Units

    ·         Intel® Core™ i3: Iris® Xe with 64 Execution Units

    ·         Intel® Processor U300E: Iris® Xe with 48 Execution Units

    Improved image (IPU6EP) and video processing (AV1/GNA 3.0)

    Support up to 4 independent displays @ 4K

  • Video Interfaces

    Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1

    1x VGA (factory option)

    1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives)

  • Video Resolution

    HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge

    eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1)

    LVDS up to 1920x1200 @ 60Hz

  • Mass Storage

    2x SATA Gen3 channels

    Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4)

  • Networking

    1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported.

  • USB

    Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation)

    4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation)

    8x USB 2.0 host ports

  • PCI-e

    Up to 8x PCI-e x1 Gen3 lanes

    1x PCI-express Graphics (PEG) x8 Gen4

    Up to 2x PCI-express Graphics (PEG) x4 Gen4

  • Audio

    HD audio and Soundwire/i2S audio interfaces

  • Serial Ports

    2x UARTs

  • Other Interfaces

    SPI, I2C, SM Bus, Thermal Management, FAN management

    Optional eSPI or LPC bus (factory alternatives)

    Optional TPM 2.0 on-board

    LID#/SLEEP#/PWRBTN#, Watchdog

    4 x GPI, 4 x GPO

  • Power Supply

    +12VDC ± 10%, +5VSB (optional), +3VRTC (optional)

  • Operating System

    Microsoft® Windows 10

    Linux Ubuntu

  • Operating Temperature

    0°C to +60°C (commercial version)*

    -40°C to +85°C (industrial version)*

    *Measured at any point of SECO standard heatspreader for this product, during

    any and all times (including start-up). Actual temperature will widely depend on

    application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature

    in the range indicated.

  • Dimensions
    125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout)

Part Number

  • SOM-COMe-BT6-RPL-P

    Part number description
    COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)
    Contact us for more informations or quotes
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