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SOM-COM-HPC-A-TGL-UP3

搭载第 11 代英特尔®酷睿™和赛扬®(原名 Tiger Lake-UP3)处理器的 COM-HPC®客户端类型模块(尺寸A)

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

11th Gen Intel® Core™ processors and Intel® Celeron® processors

Graphics

Intel® Iris Xe Graphics Core Gen12 GPU with up to 96 EU, up to 4 independent displays

Connectivity

4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3 ; 1x PCI-e x4 Gen4; up to 2x 2.5GbE

Memory

Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

Product details

Technical Info

  • Description
    搭载第 11 代英特尔®酷睿™和赛扬®(原名 Tiger Lake-UP3)处理器的 COM-HPC®客户端类型模块(尺寸A)
  • Processor

    11th Generation Intel® Core™ and Celeron® Processors, also available in industrial temperature range
    • Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) with HT, 12MB Cache, 28/15/12W cTDP
    • Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost) with HT, 8MB Cache, 28/15/12W cTDP
    • Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost) with HT, 6MB Cache, 28/15/12W cTDP
    • Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP
    • Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) with HT, 12MB Cache, with IBECC and Functional Safety Essential Design package, 28/15/12W cTDP – Industrial (w/ Turbo OFF)
    • Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost) with HT, 8MB Cache, with IBECC and Functional Safety Essential Design package, 28/15/12W cTDP - Industrial (w/ Turbo OFF)
    •Intel® Core i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost) with HT, 6MB Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)

  • Max Cores
    4
  • Memory

    2x DDR4-3200 SODIMM Slots with IBECC (In-Band Error Correction Code), up to 64GB supported

  • Graphics

    Integrated Iris Xe Graphics Core Gen12 architecture, with up to 96 Execution Units
    MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW decoding, up to 8k @60.
    AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding
    Support up to 4 independent displays.

  • Video Interfaces

    1x eDP 1.4b or MIPI_DSI 1.3
    Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI 2.0b
    Up to 4x Display Port over Type-C (Alternate mode)

  • Video Resolution

    DP, eDP: Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC
    MIPI-DSI: Up to 3200x2000 @60Hz 24 bpp, 5120x3200 @60Hz 24bpp with DSC
    HDMI 1.4: Up to 4Kx2K 24-30Hz 24bpp
    HDMI 2.0b: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-60Hz 12bpc (need dedicated redriver on carrier board)

  • Mass Storage

    2 x S-ATA Gen3 Channels
    PCI-e x4 port can be used to connect, on the carrier board,
    M.2 NVMe drives

  • Networking

    Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers
    M.2 1216 SD Module supporting WiFi 802.11abgn+ac R2
    MIMO 2x2 + MU-MIMO and Bluetooth 5.0

  • USB

    Up to 4 x USB 4.0 / USB 3.2 Host ports
    4 x USB 2.0 Host port

  • PCI-e

    1x PCI-e x4 Gen 4 port
    Up to 8x PCI-e Gen 3 lanes, groupable to support up to 4 root ports (5 root ports without the second 2.5GbE controller)

  • Audio

    SoundWire and I2S Audio Interface

  • Serial Ports

    2 x UARTs

  • Other Interfaces

    2x 4-lane CSI-2 interfaces, optional
    SPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control
    Management signals, ACPI signals, Safety Status signals
    Deep Sleep / Battery support
    Optional TPM 2.0 module on-board
    12x GPIOs

  • Power Supply

    +8VDC .. +20VDC Main power supply
    +5V stand-by

  • Operating System

    Windows 10 IoT Enterprise LTSC
    Linux Kernel LTS
    Yocto
    VxWorks 7.0
    Android

  • Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heatspreader for this product, during
    any and all times (including start-up). Actual temperature will widely depend on
    application, enclosure and/or environment. Upon customer to consider applicationspecific
    cooling solutions for the final system to keep the heatspreader temperature
    in the range indicated.

  • Dimensions
    120 x 95 mm (Com HPC Size A Form factor, Client pinout)

Part Number

  • SOM-COM-HPC-A-TGL-UP3

    Part number description
    搭载第 11 代英特尔®酷睿™和赛扬®(原名 Tiger Lake-UP3)处理器的 COM-HPC®客户端类型模块(尺寸A)
    Contact us for more informations or quotes
    联系我们

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