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SOM-COM-HPC-A-TGL-H

搭载第 11 代英特尔®至强® W-11000E 系列、酷睿™ vPro® 和赛扬®(原名 Tiger Lake-H)处理器且适用于FuSa 应用程序的 COM-HPC®客户端类型模块(尺寸A)

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

11th Gen Intel® Xeon®, Core™ and Celeron® processors

Graphics

Intel® Iris Xe Graphics Core Gen12 GPU with up to 32 EU, up to 4 independent displays

Connectivity

2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE

Memory

Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

Product details

Technical Info

  • Description
    搭载第 11 代英特尔®至强® W-11000E 系列、酷睿™ vPro® 和赛扬®(原名 Tiger Lake-H)处理器且适用于FuSa 应用程序的 COM-HPC®客户端类型模块(尺寸A)
  • Processor

    11th Generation Intel® Xeon®, Core™ and Celeron® Processors, also available in industrial temperature range.
    • Intel® Core™ vPRO® i7-11850HE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB Cache L3, 45/35W cTDP
    • Intel® Core™ vPRO® i5-11500HE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, 45/35W cTDP
    • Intel® Core™ i3-11100HE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, 45/35W cTDP
    • Intel® Celeron® 6600HE, Dual Core @2.6GHz, 8MB L3 Cache, 35W TDP
    • Intel® Xeon® vPRO® W-11865MRE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF)
    • Intel® Xeon® vPRO® W-11555MRE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF)
    • Intel® Xeon® W-11155MRE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, with ECC and TCC/TSN, 45/35W cTDP – Industrial (w/ Turbo OFF)
    • Intel® Xeon® vPRO® W-11865MLE, Eight Core @ 1.5GHz (up to 4.5GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP
    • Intel® Xeon® vPRO® W-11555MLE, Six Core @ 1.9GHz (up to 4.4GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP
    • Intel® Xeon® W-11155MLE, Quad Core @ 1.8GHz (up to 3.1GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP B Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)

  • Chipset

    Intel® RM590E, HM570E or QM580E PCH

  • Max Cores
    8
  • Memory

    2x DDR4-3200 SODIMM Slots with ECC (In-Band Error
    Correction Code), up to 64GB supported

  • Graphics

    Integrated Iris Xe Graphics Core Gen12 architecture, with up to
    32 Execution Units and up to 2 VDbox
    MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9,
    AV1 HW decoding, up to 8k60.
    AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding, up to 8k30
    Support up to 4 independent displays.

  • Video Interfaces

    1x eDP 1.4b or MIPI_DSI 1.3
    Up to 3x DP++ interface, supporting Display Port 1.4a and
    HDMI 2.0b
    Up to 2x Display Port over Type-C (Alternate mode)

  • Video Resolution

    DP, eDP:
    Up to 5120x3200 @60Hz 24bpp /
    7680x4320@60Hz 30bpp with DSC

    MIPI-DSI:
    Up to 3200x2000 @60Hz 24bpp, 5120x3200
    @60Hz 24bpp with DSC


    HDMI 1.4:
    Up to 4Kx2K 24-30Hz 24bpp


    HDMI 2.0b:
    Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-
    60Hz 12bpc (need dedicated redriver on
    carrier board)

  • Mass Storage

    2 x S-ATA Gen3 Channels
    PCI-e x4 port can be used to connect, on the carrier board,
    M.2 NVMe drives

  • Networking

    Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb
    Ethernet connection, managed by as many Intel® i225 2.5GbE
    Controllers with TSN

  • USB

    2x USB4 ports
    2x USB 3.2 Gen 2x2 ports
    8 x USB 2.0 Host ports

  • PCI-e

    1x PCI-e x4 Gen 4 port for NVME
    16x PCI-e Gen4 lanes, can be used to support 1x PCI-e x16,
    2x PCI-e x8 or (1x PCI-e x8 +2x PCI-e x4) root ports
    20x PCI-e Gen 3 lanes, groupable to support up to 12 root
    ports, max allowed grouping PCI-e x4

  • Audio

    SoundWire and I2S Audio Interface

  • Serial Ports

    2x legacy UARTs, managed by the Embedded Controller

  • Other Interfaces

    2x 4-lane CSI-2 interfaces, optional
    SPI, eSPI, SM Bus, 2x I2C, Watchdog timer, Carrier board
    FAN Control
    Management signals, ACPI signals, Safety Status signals
    Deep Sleep / Battery support
    Optional TPM 2.0 module on-board
    12x GPIOs

  • Power Supply

    +8VDC .. +20VDC Main power supply
    +5V stand-by

  • Operating System

    Windows 10 IoT Enterprise LTSC
    Linux Kernel LTS
    Yocto Project 3.0
    WindRiver VxWorks 7.0
    Android

  • Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial Range)

  • Dimensions
    120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)

Part Number

  • SOM-COM-HPC-A-TGL-H

    Part number description
    搭载第 11 代英特尔®至强® W-11000E 系列、酷睿™ vPro® 和赛扬®(原名 Tiger Lake-H)处理器且适用于FuSa 应用程序的 COM-HPC®客户端类型模块(尺寸A)
    Contact us for more informations or quotes
    联系我们

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