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SECOMExp-ION

COM-Express™ Module with Intel® Celeron® T3100 / Intel® Atom™ N270 CPU and NVIDIA® ION Chipset with Dual Channel Memory

Product status

Development
Sampling
Production

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CPU

NVIDIA® MMP9 Embedded ION™ Chipset

Graphics

NVIDIA® GeForce 9400 Graphic Controller

Connectivity

PCI-e Graphics x16 interface; 3x PCI-e x1 ports

Memory

4 GB

Product details

Technical Info

  • Description
    SECOMExp-iCORE-XT is a basic form factor, type 2 COM-Express™ module designed by SECO, also compliant to latest COM Express™ Extension specifications, based on the Intel® Core™ i7-660UE CPU and high performance Intel® HM55 Express Chipset, integrating HDMI, DVI and Display Port support, with usage of DDR3 Memories with Speed up to 1066MHz. With the reduction of the FSB of the CPU to a fixed frequency of 100MHz, the adoption of industrial temperature range components (except for CPU and Chipset), and the use of adequate heatsinks for higher temperatures, this board can offer the performance(*) of Intel iCore CPU in harsher environments, requiring extended temperature range. (*) Performances of i7-660UE with reduced FSB are equivalent to those of i7-620UE at full speed FSB
  • Processor

     

    Intel® Celeron® T3100 @ 1,9GHz, 1MB L2 Cache,

    800MHz FSB, Dual Core, 64-bit Instruction Set

    Intel® Atom™ N270 @ 1,6GHz, 512KB L2 Cache,

    533 MHz FSB, HyperThreading, 32-bit Instruction Set

  • Chipset

     

    NVIDIA® MMP9 Embedded ION® Chipset

  • Memory

    up to 4GB of 1066MHz DDR3 on two SO-DIMMs

    supporting dual channel

  • Graphics

    integrated NVIDIA® GeForce 9400 Graphic Controller, with 16 graphic/computational cores

  • Video Interfaces

    LVDS, Single/Dual Channel 18/24 Bit LVDS Transmitter

  • Video Resolution

     

    Up to 1600 x 1200 on LVDS

    Up to 1920 x 1440 on CRT interface

  • Mass Storage

     

    1 x P-ATA channel
    4 x S-ATA channels

  • Networking

     

    Gigabit Ethernet port

  • USB

     

    8x USB 2.0 ports

  • PCI-e

     

    PCI Express Graphics x16 interface
    3x PCI Express x1 ports

  • Audio

     

    HD Audio Interface

  • Other Interfaces

    PCI Bus

    LPC BUS for legacy peripherals

    SM Bus

    I2C Bus

  • Power Supply

     

    +12VDC and +5VSB for ATX mode

  • Operating Temperature

    -25°C ÷ +70°C with finned heatsink

  • Dimensions
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)

Part Number

  • SECOMExp-ION

    Part number description
    COM-Express™ Module with Intel® Celeron® T3100 / Intel® Atom™ N270 CPU and NVIDIA® ION Chipset with Dual Channel Memory
    Contact us for more informations or quotes
    联系我们