DEV-KIT-COMe-T7

2x SATA 7p M connectors
µSD Card slot (interface multiplexed with GPIO header)

1x GbEthernet RJ-45 connector 4x 10Gbase-KR interfaces on OCP Type-C connector 4x MDIO I2C interfaces on internal pin header 4x SDP interfaces on SMA RF connectors

4x USB 3.1 Host ports on Dual Type-A sockets

2 x RS-232 ports on dedicated pin header (from module)

BMC connector with SM Bus, I2C, LPC, 1x USB 2.0, 1x PCI-e x1, NCSI signals
4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot)
SPI Flash Socket
Button / LEDs front panel header
4-pin tachometric FAN connector
I2C + SM Bus on feature Pin header
I2C Flash Socket
SM Bus Smart Battery Connector
4 x 7-segment LCD displays for POST codes
LPC/eSPI internal header
USB Overcurrent header
JTAG connector
FuSa header
SPI Flash header
Buzzer

ATX 24 poles connector for carrier board working only

Auxiliary 12V connector  for carrier board working only

12 VDC power in connector for COM Express module’s working

Cabled Coin-cell connector for RTC

0° ÷ +60°C (commercial version)

*All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.