Carrier-COMe-T6-C30

1 x DP++ connector
2 x miniDP++ connectors
LVDS 24-bit Single/Dual Channel
LVDS External EDID flash socket
eDP 4-lanes 40 poles VESA connector

S-ATA 7p M connector + 4 pins power connector
M.2 Socket 2 2260 Key B slot for SSD
M.2 Socket 3 2280 Key  M slot for PCI-e x4 SSDs
μSD Card slot (interface multiplexed with GPIO header)

Dual RJ-45 connector (1 port managed by COM Express Gigabit Ethernet interface, 1 port managed by Carrier board’s Intel® I21x GbEthernet controller)
M.2 Socket 2 2242 / 3042 Key B slot for WWAN modules (modem)
M.2 Socket 1 2230 Key E slot for WiFi / BT modules

3 x USB 3.0 Host ports on Type-A sockets
2 x USB 2.0 Host ports on Type-A sockets
1 x USB 2.0 Host port on internal pin header

On-board HD Audio Codec (Realtek ALC262)
Mic In + Line Out internal pin header

2 x RS-232 / RS-422 / RS-485 ports on internal pin header (from carrier board’s SuperI/O)
2 x RS-232 ports on feature pin header (from module)

microSIM slot for M.2 modem
4 x GPI + 4 x GPO pin header (interface multiplexed with μSD slot)
Button / LEDs front panel header
3-pin tachometric FAN connector
I2C + SM Bus on feature Pin header
LPC internal header

19÷24 VDC fixed (only CPU modules with max 45W TDP supported)
Mega-Fit® 2x1 Power Connector
Cabled Coin-cell connector for RTC

0°C ÷ +50°C 

*All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.