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我们的产品

面向最具创新性项目的一系列广泛的 SECO 产品：模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案，以及载板、入门套件和所有能有助完成您的项目的配件。

283 Products

i-PAN T7 II (by Keith & Koep)

HMI for Trizeps SODIMM SOMs

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Myon I

搭载骁龙™ 410E 的微型中央处理器模块

  • Onboard WLAN 802.11 b/g/n 2.4 GHz, Bluetooth 4.1, USB 2.0, LVDS, MIPI Display and Kamera
  • OpenGL ES 3.0, OpenCL / DirectX 12 graphics acceleration support for Windows 10 IoT Core
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NALLINO 4.3 OF PCT

基于恩智浦 i.MX6ULL 处理器的 4.3 英寸后置式人机界面

  • 1x 100MbE, 2x USB, RS232, RS485, CAN
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[Picture] ORION_website_front

SOM-COM-HPC-A-ADL-P

搭载第 12 代英特尔®酷睿™（原名 Alder Lake-P系列）处理器的 COM-HPC®客户端类型模块（尺寸A）

  • 2x 2.5GbE; 4x USB4 Gen 2x2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2
  • Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
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Titan 200 MX8

搭载恩智浦 i.MX 8 应用处理器的无风扇嵌入式计算机

  • 2x GbE; 1x USB3.0; 1x USB2.0; 1x RS-232; 1x multistandard RS-485 / RS-422; Optional WiFi+BT add-on module; Optional WWAN add-on module
  • Dual Vivante GC7000 GPU / Dual Vivante GC7000Lite GPU
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Titan 210 MX8M

搭载恩智浦 i.MX 8M 应用处理器的无风扇嵌入式计算机

  • 1x GbE; 1x USB3.0; 2x USB2.0; 1x RS-232; Optional on-board WiFi+BLTE; Optional WWAN add-on module
  • Vivante GC7000Lite GPU
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Titan 225 RK3399

基于 Rockchip RK3399 应用处理器的无风扇嵌入式计算机

  • 2x GbE; 2x USB3.0; 2x USB2.0; 2x RS-232 or RS-485; Optional on-board WiFi+BT; Optional on-board LTE modem
  • 4-Core Mali-T860MP4 GPU
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SOM-Q7-EHL

搭载英特尔®凌动® X6000E 系列、英特尔®奔腾®和赛扬® N 和 J 系列 SoC（原名 Elkhart Lake）的 Qseven®Rel. 2.1 兼容模块

  • 1x GbE with precision time protocol IEEE 1588, 6x USB 2.0, 2x SuperSpeed USB 10Gbps, up to 4x PCI-e
  • Integrated Intel® Gen11 UHD Graphics controller, up to 32 Execution Units
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SBC-pITX-EHL

搭载英特尔®凌动® X6000E 系列、英特尔® 奔腾®和赛扬® N 和 J 系列（原名 Elkhart Lake）SoC 的 Pico-ITX 单板计算机

  • 2x GbE with precision time protocol IEEE 1588, M.2 WWAN and WLAN slots
  • Integrated Intel® Gen11 UHD Graphics controller, up to 32 Execution Units
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SOM-COMe-CT6-V2000

搭载 AMD 锐龙™嵌入式 V2000 SoC 的 COM Express® 3.0 紧凑型 6 型模块

  • 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen3
  • Integrated AMD Radeon™ GPU with up to 7 Compute Units
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pConXS (by Keith & Koep)

Carrier Board for Trizeps SODIMM SOMs

  • HDMI, LVDS or Dual LVDS, RGB interfaces enable easy integration of various touch displays
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SOM-COMe-BT7-ICL-D

搭载英特尔®至强® D-1700 处理器（原名 Ice Lake-D）的 COM Express® 3.0 基本型 7 型模块

  • 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes
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[Picture] Q7 STARTER KIT 2.1

Q7 STARTER KIT 2.1

Cross Platform Starter Kit compatible with both x86 and Arm Rel. 2.0 / 2.1 Qseven® modules

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[Picture] CQ7-D59_front

CQ7-D59

Carrier Board for Qseven® Rel. 2.0 / 2.1 Compliant Modules in the 3.5” Form Factor

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[Picture] ConXT by Keith & Koep

ConXT (by Keith & Koep)

Carrier Board for Trizeps VII SOMs

  • Supports a wide range of interfaces, e.g. 2x Ethernet, 2x CAN, 2x USB, RS232, RS422, RS485
  • Unified display interface standards as our own i-MOD extension connectors simplify the integraton of touchscreen LCDs
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