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56 Products

SOM-COMe-BT7-ICL-D

搭载英特尔®至强® D-1700 处理器（原名 Ice Lake-D）的 COM Express® 3.0 基本型 7 型模块

  • 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes
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[Picture] PRISMA_1000x1000

SBC-3.5-TGL-UP3

3.5” SBC with the 11th Gen Intel® Core™ and Intel® Celeron® (formerly Tiger Lake UP3) Processors

  • 2x SuperSpeed USB 10Gbps; 2x SuperSpeed USB 20Gbps; 2x USB 2.0; 4x PCIe Gen3; 2x 2.5GbE
  • Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
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UDOO VISION

搭载英特尔®凌动® X 系列、英特尔®赛扬® N 系列、英特尔®奔腾® N 系列（原名 Apollo Lake）处理器的 Pico-ITX 单板计算机

  • 1x GbE; 1x USB 3.0; 1x USB 2.0; M.2 Socket 1 Key E 2230 slot for Wi-Fi+BTLE modules
  • Integrated Graphics, three independent display support
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[Picture] CALLISTO main image

SOM-COMe-BT6-RPL-P

COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)

  • 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4.
  • embedded Intel® Iris® Xe graphics with up to 96 execution units
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[Picture] FINLAY_main front

SOM-SMARC-ADL-N

SMARC® Rel. 2.1 compliant module with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N)

  • 2 x NBase-T (2.5GbE supported); 2x USB 3.2 Gen 2; 6x USB 2.0; 4x PCI-e Gen3 lanes with optional SERDES
  • Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution
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SOM-Q7-MX8

搭载恩智浦 i.MX 8M 应用处理器的 Qseven®Rel. 2.1 模块

  • 1x USB 3.0; 4x USB2.0; up to 2x PCI-e x1 Gen2; 1x CAN Bus; 2x UART; 8x GPI/Os
  • Integrated GPU, supports 2 independent displays
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[Picture] MAURY_front main

SOM-SMARC-MX93

SMARC® Rel. 2.1.1 module with NXP i.MX 9 Applications Processors

  • Display up to FHD
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SBC-3.5-RK3568

3.5” SBC with Rockchip RK3568 SoC

  • 2x GbE; opt Wi-Fi; 2x RS-232 or RS-485, 2x CAN; M.2 slot for modem and on-board microSIM slot
  • Mali-G52 1-Core-2EE
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[Picture] SOM-COM-HPC-A-RPL_front main

SOM-COM-HPC-A-RPL

采用第13代英特尔®酷睿™处理器（代号：猛禽湖 - H/P/U 系列）的 COM-HPC® 客户端模块尺寸 A。

  • 2x 2.5GbE; 4x USB4.0 / USB 3.2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2
  • Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
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SOM-SMARC-ASL

符合SMARC® Rel 2.1标准的模块，采用用于Edge应用的Intel Atom® x7000RE系列处理器

  • 2 x NBase-T（支持2.5GbE）；6x 高速USB；2x USB 10Gbps；4x PCI-e Gen3通道，带可选的SERDES
  • 2 x NBase-T（支持2.5GbE）；6x 高速USB；2x USB 10Gbps；4x PCI-e Gen3通道，带可选的SERDES
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SOM-COMe-CT6-ASL

采用Intel Atom® x7000E系列处理器（代号：Amston Lake和Alder Lake N）的COM Express® 3.1 Type 6紧凑型模块

  • 1x NBase-T 2.5GbE; up to 2x USB 10Gbps + 3x USB 5Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen3
  • 集成的Intel® Gen12 UHD图形控制器，最多支持32个执行单元
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