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处理器

125 Products
[Picture] DORADO_Main

Titan 220 RK3399

基于 Rockchip RK3399 应用处理器的 IP20 无风扇嵌入式电脑

  • 1x GbE; 2x USB3.0; 3x USB2.0; 2x RS-232; on-board Wi-Fi+BT5.0; on-board LTE Cat4 modem
  • 4-Core Mali-T860MP4 GPU
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[Picture] CHAMALEON_main image

Titan 250 APL IP65

搭载英特尔®凌动™ x5（原名 Apollo Lake）应用处理器的IP65 无风扇嵌入式电脑

  • up to 4x GbE; WWAN and WLAN M.2 module slots
  • Integrated Intel® HD Graphics 500 series controller
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[Picture] PRISMA_1000x1000

SBC-3.5-TGL-UP3

3.5” SBC with the 11th Gen Intel® Core™ and Intel® Celeron® (formerly Tiger Lake UP3) Processors

  • 2x SuperSpeed USB 10Gbps; 2x SuperSpeed USB 20Gbps; 2x USB 2.0; 4x PCIe Gen3; 2x 2.5GbE
  • Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
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SOM-COMe-CT6-TGL-U

搭载第11代英特尔®酷睿™（原名 Tiger Lake UP3）处理器的 COM Express®Rel. 3.0 紧凑型 6 型模块

  • 1x GbE; 4x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x4 Gen4
  • Integrated Intel® Iris® Xe Graphics, up to 96 Execution Units
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UDOO VISION

搭载英特尔®凌动® X 系列、英特尔®赛扬® N 系列、英特尔®奔腾® N 系列（原名 Apollo Lake）处理器的 Pico-ITX 单板计算机

  • 1x GbE; 1x USB 3.0; 1x USB 2.0; M.2 Socket 1 Key E 2230 slot for Wi-Fi+BTLE modules
  • Integrated Graphics, three independent display support
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[Picture] PHOENIX_1000x1000 con ombra

Titan 300 TGL-UP3

搭载第11代英特尔®酷睿™和英特尔®赛扬® SoC （原名 Tiger Lake UP3）的无风扇嵌入式计算机

  • 2x 2.5 GbE, Optional M.2 WWAN and WLAN modules
  • Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
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[Picture] PYXIS_1000x1000 con ombra

Titan 290 EHL

搭载英特尔®凌动® X6000E 系列、英特尔®奔腾®和赛扬® N 和 J 系列（原名 Elkhart Lake）SoC的无风扇嵌入式计算机

  • 2x GbE, Optional M.2 WWAN and WLAN modules
  • Integrated Intel® Gen11 UHD Graphics controller, up to 32 Execution Units
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[Picture] CALLISTO main image

SOM-COMe-BT6-RPL-P

COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)

  • 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4.
  • embedded Intel® Iris® Xe graphics with up to 96 execution units
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[Picture] FINLAY_main front

SOM-SMARC-ADL-N

SMARC® Rel. 2.1 compliant module with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N)

  • 2 x NBase-T (2.5GbE supported); 2x USB 3.2 Gen 2; 6x USB 2.0; 4x PCI-e Gen3 lanes with optional SERDES
  • Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution
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SOM-Q7-MX8

搭载恩智浦 i.MX 8M 应用处理器的 Qseven®Rel. 2.1 模块

  • 1x USB 3.0; 4x USB2.0; up to 2x PCI-e x1 Gen2; 1x CAN Bus; 2x UART; 8x GPI/Os
  • Integrated GPU, supports 2 independent displays
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[Picture] MAURY_front main

SOM-SMARC-MX93

SMARC® Rel. 2.1.1 module with NXP i.MX 9 Applications Processors

  • Display up to FHD
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SBC-3.5-RK3568

3.5” SBC with Rockchip RK3568 SoC

  • 2x GbE; opt Wi-Fi; 2x RS-232 or RS-485, 2x CAN; M.2 slot for modem and on-board microSIM slot
  • Mali-G52 1-Core-2EE
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[Picture] SOM-COM-HPC-A-RPL_front main

SOM-COM-HPC-A-RPL

采用第13代英特尔®酷睿™处理器（代号：猛禽湖 - H/P/U 系列）的 COM-HPC® 客户端模块尺寸 A。

  • 2x 2.5GbE; 4x USB4.0 / USB 3.2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2
  • Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
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Modular Vision 7 MX93

基于 NXP i.MX93 的入门级七英寸人机界面 (HMI)

  • Gb Ethernet, RS485, CAN, RS232, USB, Digital I/O
  • 2D graphics
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[Picture] Modular Vision 15.6 EHL_1

Modular Vision 15.6 EHL

基于英特尔® Atom®（前身为 Elkhart Lake）的高端 15.6 英寸人机界面 (HMI)

  • Gb Ethernet, RS485, CAN, RS232, USB, Digital I/O
  • Integrated Gen11 UHD Graphics controller supporting 3 independent displays
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