• zh
close
If you are looking for a product visit https://edge.seco.com/zh/
Home / 

结构

112 Products

SBC-3.5-RK3568

3.5” SBC with Rockchip RK3568 SoC

  • 2x GbE; opt Wi-Fi; 2x RS-232 or RS-485, 2x CAN; M.2 slot for modem and on-board microSIM slot
  • Mali-G52 1-Core-2EE
SHOW DETAILS
Development
Sampling
Production
SHOW DETAILS
Development
[Picture] SOM-COM-HPC-A-RPL_front main

SOM-COM-HPC-A-RPL

采用第13代英特尔®酷睿™处理器（代号：猛禽湖 - H/P/U 系列）的 COM-HPC® 客户端模块尺寸 A。

  • 2x 2.5GbE; 4x USB4.0 / USB 3.2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2
  • Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
SHOW DETAILS
Development
Sampling
Production
SHOW DETAILS
Production

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

  • 2x 2.5 GbE, Optional M.2 WWAN and WLAN modules
  • Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
SHOW DETAILS
Development
Sampling
Production
SHOW DETAILS
Production

Palladio 500 RPL

  • Intel® embedded M.2 2230 802.11ac Wi-Fi BT 5.1 card with cables ; dual-band wireless 6.3” terminal PIFA antenna; 2x 2.5 GbE LAN (2x PoE optional)
  • Up to Intel® UHD graphics 770 (processor dependent)
SHOW DETAILS
Development
Sampling
Production
SHOW DETAILS
Development

SOM-COM-HPC-A-MTL

COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)

  • Up to 2x NBase-T 2.5GbE; up to 2x USB 20Gbps + 2x USB 10Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen4
  • Integrated Intel® Xe LPG graphic controller with up to 128 EU
SHOW DETAILS
Development
Sampling
Production
SHOW DETAILS
Development

SOM-SMARC-ASL

符合SMARC® Rel 2.1标准的模块，采用用于Edge应用的Intel Atom® x7000RE系列处理器

  • 2 x NBase-T（支持2.5GbE）；6x 高速USB；2x USB 10Gbps；4x PCI-e Gen3通道，带可选的SERDES
  • 2 x NBase-T（支持2.5GbE）；6x 高速USB；2x USB 10Gbps；4x PCI-e Gen3通道，带可选的SERDES
SHOW DETAILS
Development
Sampling
Production
SHOW DETAILS
Development

SOM-COMe-CT6-ASL

采用Intel Atom® x7000E系列处理器（代号：Amston Lake和Alder Lake N）的COM Express® 3.1 Type 6紧凑型模块

  • 1x NBase-T 2.5GbE; up to 2x USB 10Gbps + 3x USB 5Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen3
  • 集成的Intel® Gen12 UHD图形控制器，最多支持32个执行单元
SHOW DETAILS
Development
Sampling
Production
SHOW DETAILS
Development