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Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

  • 2x 2.5 GbE, Optional M.2 WWAN and WLAN modules
  • Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
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Palladio 500 RPL

  • Intel® embedded M.2 2230 802.11ac Wi-Fi BT 5.1 card with cables ; dual-band wireless 6.3” terminal PIFA antenna; 2x 2.5 GbE LAN (2x PoE optional)
  • Up to Intel® UHD graphics 770 (processor dependent)
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SOM-COM-HPC-A-MTL

COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)

  • Up to 2x NBase-T 2.5GbE; up to 2x USB 20Gbps + 2x USB 10Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen4
  • Integrated Intel® Xe LPG graphic controller with up to 128 EU
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SOM-SMARC-ASL

符合SMARC® Rel 2.1标准的模块，采用用于Edge应用的Intel Atom® x7000RE系列处理器

  • 2 x NBase-T（支持2.5GbE）；6x 高速USB；2x USB 10Gbps；4x PCI-e Gen3通道，带可选的SERDES
  • 2 x NBase-T（支持2.5GbE）；6x 高速USB；2x USB 10Gbps；4x PCI-e Gen3通道，带可选的SERDES
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SOM-COMe-CT6-ASL

采用Intel Atom® x7000E系列处理器（代号：Amston Lake和Alder Lake N）的COM Express® 3.1 Type 6紧凑型模块

  • 1x NBase-T 2.5GbE; up to 2x USB 10Gbps + 3x USB 5Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen3
  • 集成的Intel® Gen12 UHD图形控制器，最多支持32个执行单元
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